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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom ch

In inglese

Company

Amazon

Location

Haifa, Haifa, ISR

Status

Open

Posted

2026-09-24T00:00:00+00:00

Annapurna Labs, part of AWS, is hiring a Package Layout Design Engineer for its hardware team in Haifa. The role covers IC package layout from floor planning through tape out, including bump and pad assignment, RDL and substrate routing, 2.5D/3D-IC and fan-out packaging, and physical verification. The posting asks for five or more years in package layout, hands-on Cadence or similar tools, and knowledge of DFM, TSVs, microbumps, and power/ground design. Work supports machine learning and data center ASICs, with collaboration across SI/PI and manufacturing.