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Manufacturing Engineer Packaging & OSAT
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software
In inglese
- Company
- Tenstorrent
- Location
- 新北市, New Taipei City, Taiwan
- Status
- Open
- Posted
- 2026-09-16T03:08:58+00:00
Tenstorrent wants a hands-on manufacturing engineer to own the interface between package design, semiconductor assembly, package test, board assembly and final product integration. The work covers process flows, control plans, factory commissioning, qualification lots and ramps, plus yield metrics, SPC and corrective actions with OSATs, substrate suppliers, test houses and contract manufacturers. Applicants need five or more years in semiconductor packaging, OSAT, assembly, PCBA, product engineering or NPI. The posting lists an on-site work type while describing the role as remote-based in Taiwan with regular partner-factory visits.
Original job posting