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Advanced Packaging Reliability Engineer

About the Team:OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native s

In inglese

Company

OpenAI

Location

San Francisco

Status

Open

Posted

2026-06-16T22:30:59.069+00:00

OpenAI's Hardware group is hiring a reliability engineer for advanced packages used in AI supercomputing systems. The role covers reliability test plans, failure-mechanism analysis, root-cause investigation and corrective actions across architecture, qualification and high-volume manufacturing. The engineer will use thermal and mechanical finite-element modeling to guide package design, materials and assembly choices, and will predict electromigration lifetime for package interconnects. The posting asks for 8+ years in semiconductor package reliability and depth in 2.5D/3.5D integration, interposers and HBM. Work is hybrid in San Francisco.